Renesas’ new RA6W1 and RA6W2 MCUs combine wireless connectivity and processing in a single device, reflecting growing demand for compact, power‑efficient solutions in smart‑home, industrial and consumer applications. The companies say the integration of Ceva‑Waves Wi‑Fi 6 and Bluetooth LE IP is intended to deliver reliable wireless performance while simplifying product design and reducing time‑to‑market.
The RA6W1 is a dual‑band Wi‑Fi 6 MCU, while the RA6W2 offers a combined Wi‑Fi 6 and Bluetooth LE platform. Both allow developers to choose between standalone Wi‑Fi, a Wi‑Fi/Bluetooth LE combination, or fully integrated modules depending on the needs of each project. Renesas says the devices support both hosted and hostless configurations, helping designers lower power consumption, reduce component count and streamline system integration.
“Connected devices are advancing at an unprecedented pace, opening new opportunities in IoT and industrial applications,” said Chandana Pairla, Vice President of Connectivity at Renesas. “By incorporating Ceva’s Wi‑Fi and Bluetooth LE IPs into our MCUs, we are delivering system‑level connectivity that combines high performance with exceptional energy efficiency. This integration helps customers reduce design complexity, extend battery life, and accelerate time to market in smart home and industrial automation applications.”
Ceva’s Waves portfolio spans Wi‑Fi 6/7, Bluetooth LE, Bluetooth Dual Mode, 802.15.4, Ultra‑Wideband and multiprotocol platforms supporting technologies such as Thread, Zigbee and Matter. The company positions the range as a way for chipmakers to embed standards‑compliant wireless connectivity directly into microcontrollers and system‑on‑chip designs.
